Chipset Developer DSP Group Makes Moves into Automotive Market
The Israel-linked company provided the hardware for a new device that will enable HearMeOut’s voice-based social media app to run while users are driving
16:1705.01.18
DSP Group, Inc., a San Jose, California-headquartered developer of communications chipsets, has partnered with Israel-based HearMeOut Ltd., which offers a voice and sound based social media app.
A road in Israel. Photo: Yuval Chen A HOOP prototype will be presented at the CES conference in Las Vegas next week.
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The two companies have developed a device called HOOP that allows users to access HearMeOut’s app while driving, according to a joint announcement released on Thursday.
A road in Israel. Photo: Yuval Chen DSP Group is traded on Nasdaq and was found by Israeli entrepreneurs in 1987. The new device represents the chipset developer’s first push into the automotive market.
Founded in 2016, HearMeOut is listed on the Australian Securities Exchange and maintains offices in the United States, Israel and Australia.
"Because HOOP is compatible with any car steering wheel, we allow drivers to safely use the platform with both hands on the wheel and they don't have to worry about not being heard or repeating themselves,” said Lior Menashe, HearMeOut’s chief technology officer and a co-founder.
"DSP Group's SmartVoice processor, with its superior noise suppression and voice isolation technology, is uniquely positioned to handle the environment and voice-driven applications necessary to keep drivers focused on the road," said DSP Group CEO Ofer Elyakim.
